Kunconywa ukuthi izimbobo zomsindo wangaphandle kulo lonke ikesi zibe seduze ne-MIC ngangokunokwenzeka, engenza ukwakheka kwama-gasket kube lula kanye nezakhiwo zemishini ezihlobene. Ngesikhathi esifanayo, imbobo yomsindo kufanele igcinwe ikude ngangokunokwenzeka kuzipikha nakweminye imithombo yomsindo ukuze kuncishiswe umthelela walezi zimpawu ezingadingekile kokokufaka kwe-MIC.
Uma kusetshenziswa ama-MIC amaningi ekwakhiweni, ukukhethwa kwendawo yembobo yomsindo ye-MIC kunqunyelwe imodi yohlelo lomkhiqizo nokusebenzisa i-algorithm. Ukukhetha indawo ye-MIC kanye nembobo yayo yomsindo kusenesikhathi enqubweni yokuklama kungagwema umonakalo odalwe ukushintsha kwakamuva kwekesi. Izindleko zezinguquko zesekethe ye-PCB.
umklamo wesiteshi somsindo
Ijika lokuphendula imvamisa ye-MIC kuwo wonke umklamo womshini lincike ejikeni lokuphendula imvamisa ye-MIC ngokwayo kanye nobukhulu bomshini bengxenye ngayinye yesiteshi sokungenisa umsindo, okuhlanganisa nosayizi wembobo yomsindo ku-casing, usayizi we- i-gasket kanye nosayizi wokuvulwa kwe-PCB. Ngaphezu kwalokho, akufanele kube khona ukuvuza esiteshini esingenisa umsindo. Uma kukhona ukuvuza, kungabangela kalula izinkinga ze-echo nomsindo.
Isiteshi sokufakwayo esifushane nesibanzi sinomthelela omncane kwijika lokuphendula imvamisa ye-MIC, kuyilapho umzila wokufakwayo omude futhi omncane ungakha ama-resonance aphakeme ebangeni lefrikhwensi yomsindo, futhi ukwakheka okuhle kwesiteshi okokufaka kungafinyelela umsindo oyisicaba ebangeni lomsindo. Ngakho-ke, kunconywa ukuthi umklami akale ijika lokuphendula imvamisa ye-MIC nge-chassis kanye neshaneli yokungenisa umsindo phakathi nomklamo ukuze ahlulele ukuthi ukusebenza kuyahlangabezana yini nezidingo zedizayini.
Ngomklamo usebenzisa i-MEMS MIC yomsindo oya phambili, ububanzi bokuvulwa kwe-gasket kufanele okungenani bube mkhulu ngo-0.5mm kunobubanzi bembobo yomsindo yemakrofoni ukugwema ithonya lokuchezuka kokuvulwa kwe-gasket kanye indawo yokubeka ku-x kanye no-y, kanye nokuqinisekisa ukuthi i-gasket isebenza njengophawu. Ngomsebenzi we-MIC, ububanzi bangaphakathi be-gasket akumele bube bukhulu kakhulu, noma yikuphi ukuvuza komsindo kungase kubangele i-echo, umsindo nezinkinga zokuphendula imvamisa.
Ngomklamo osebenzisa umsindo wangemuva (ubude obuyiziro) i-MEMS MIC, isiteshi sokungenisa umsindo sihlanganisa iringi yokushisela phakathi kwe-MIC ne-PCB yawo wonke umshini kanye nembobo ephumela ku-PCB yawo wonke umshini. Imbobo yomsindo ku-PCB yomshini wonke kufanele ibe nkulu ngokufanele ukuqinisekisa ukuthi ayithinti ijika le-Frequency response, kodwa ukuze kuqinisekiswe ukuthi indawo yokushisela yendandatho yomhlabathi ku-PCB ayinkulu kakhulu, kunconywa ukuthi ububanzi bokuvulwa kwe-PCB yawo wonke umshini busukela ku-0.4mm kuye ku-0.9mm. Ukuze uvimbele ukunamathisela kwe-solder ukuthi kungancibiliki embotsheni yomsindo futhi kuvimbe imbobo yomsindo phakathi nenqubo yokugeleza kabusha, imbobo yomsindo ku-PCB ayikwazi ukwenziwa ngensimbi.
I-Echo ne-Noise Control
Iningi lezinkinga ze-echo zidalwa ukuvaleka kahle kwe-gasket. Ukuvuza komsindo ku-gasket kuzovumela umsindo wophondo neminye imisindo ukuthi ingene ngaphakathi kwecala futhi ithathwe yi-MIC. Izophinda ibangele umsindo womsindo okhiqizwe eminye imithombo yomsindo ukuthi ulandwe yi-MIC. I-Echo noma izinkinga zomsindo.
Ngezinkinga ze-echo noma zomsindo, kunezindlela ezimbalwa zokuthuthukisa:
A. Nciphisa noma ubeke imingcele yokuphakama kwesiginali yesipikha;
B. Khulisa ibanga phakathi kwesipikha ne-MIC ngokushintsha indawo yesikhulumi kuze kube i-echo iwela ebangeni elamukelekayo;
C. Sebenzisa isofthiwe ekhethekile yokukhansela i-echo ukuze ukhiphe isignali yesipikha ekugcineni kwe-MIC;
D. Yehlisa inzuzo yangaphakathi ye-MIC ye-chip ye-baseband noma i-chip eyinhloko ngezilungiselelo zesofthiwe
Uma ufuna ukwazi okwengeziwe, sicela uchofoze iwebhusayithi yethu:,
Isikhathi sokuthumela: Jul-07-2022
